US Patent Issued to IBIDEN on July 15 for "Printed wiring board and method for manufacturing printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,827, issued on July 15, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board and method for manufacturing printed wiring board" was invented by Yoshiki Matsui (Ogaki, Japan) and Atsushi Deguchi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, bumps including a first bump and a second bump such that the first bump is form...