ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,435, issued on Jan. 27, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan), Jun Sakai (Ogaki, Japan) and Kyohei Yoshikawa (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer, a second conductor layer, and a via conductor formed in an opening of the insulating layer and connecting the first conductor and second conductor layers. The second conductor layer and via conductor include a seed layer having a first portion formed on the surface of the insulating layer, a second portion formed on an in...