ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,759, issued on Jan. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan), Masashi Kuwabara (Ibi-gun, Japan) and Susumu Kagohashi (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first build-up part including first insulating layers, first conductor layers formed on the first insulating layers, and first via conductors formed in the first insulating layers, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers formed on the second insulating layers, and second via condu...