US Patent Issued to IBIDEN on Feb. 3 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,273, issued on Feb. 3, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Jun Sakai (Ogaki, Japan), Takuya Inishi (Ogaki, Japan) and Susumu Kagohashi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a ...