ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,257, issued on Feb. 18, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Shunsuke Sakai (Ogaki, Japan), Shuto Iwata (Ogaki, Japan), Ikuya Terauchi (Ogaki, Japan) and Takahiro Yamada (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the op...