US Patent Issued to IBIDEN on Feb. 10 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,255, issued on Feb. 10, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan) and Kiyohiro Ishikawa (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first ...