ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,489, issued on Dec. 9, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Printed wiring board" was invented by Jun Sakai (Ogaki, Japan) and Shiho Shimada (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer and including a conductor circuit, and a via conductor formed in an opening formed in the insulating layer and connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer ...