ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,828, issued on Dec. 30, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Method for manufacturing printed wiring board" was invented by Yuji Kadowaki (Ogaki, Japan) and Tomomi Kano (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an ...