ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,342, issued on Dec. 23, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate and method for manufacturing wiring substrate" was invented by Yoshinori Takenaka (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the inter-wiring distance between the closest two wirings of the wirings in the embedded wiring layer is in...