US Patent Issued to IBIDEN on Aug. 26 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,248, issued on Aug. 26, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Kiyoteru Otomi (Ogaki, Japan) and Katsutoshi Ito (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land first plane parts, the second conductor layer includes second land second plane parts, the third conductor layer includes fine wirings and a third plane pa...