ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,025, issued on Aug. 12, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan) and Masashi Kuwabara (Ibi-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes insulating layers, conductor layers formed on the insulating layers, and via conductors formed in the insulating layers such that the via conductors are connecting the conductor layers through the insulating layers. The conductor layers include a first conductor layer and the outermost conductor layer formed such that the outermost conductor layer includes first conductor pads positioned to mount a fi...