US Patent Issued to IBIDEN on April 29 for "Wiring substrate and method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,838, issued on April 29, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate and method for manufacturing wiring substrate" was invented by Yasuki Kimishima (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, a second conductor layer formed on the second insulating layer, and a via conductor formed in the second insulating layer such that the via conductor is connecting the first and second conductor layers. The second insulating layer has a via hole i...