ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,829, issued on April 29, was assigned to IBIDEN Co. Ltd. (Gifu, Japan).
"Printed wiring board" was invented by Jun Sakai (Ogaki, Japan) and Takuya Inishi (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the sec...