ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,414, issued on Sept. 30, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module and manufacturing method thereof" was invented by Hyeon Uk Kim (Hwaseong-Si, South Korea), Myung Ill You (Gwangju, South Korea), Hyun Koo Lee (Seoul, South Korea) and Jun Hee Park (Hwaseong-Si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electr...