ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,334, issued on Nov. 4, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Heat pump system for vehicle" was invented by Seong-Bin Jeong (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment heat pump system includes a valve module for controlling a flow of a coolant, a first line connected to the valve module, an electrical component on the first line, a second line connected to the first line and the valve module, a radiator on the second line, a third line connected to the valve module, a battery module on the third line, a fourth line connected to the third line, a fifth lin...