ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,187, issued on Nov. 25, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Cooling apparatus for power module" was invented by Se Heun Kwon (Incheon, South Korea), Hyong Joon Park (Hwaseong-Si, South Korea) and Sang Hun Lee (Taebaek-Si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling apparatus for power modules includes a manifold cover and a pin plate, and generates vertical turbulent flow of the cooling fluid in such a way as to spray the cooling fluid vertically onto the heat-generating surface using cooling fins of a pin plate configured in the lengthwise and vertical directions of a ...