ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,739, issued on May 27, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).
"Heat pump system for vehicle" was invented by Jae Yeon Kim (Hwaseong-si, South Korea), Wan Je Cho (Hwaseong-si, South Korea), Seong-Bin Jeong (Hwaseong-si, South Korea), Yeonho Kim (Seoul, South Korea), Jeawan Kim (Hwaseong-si, South Korea), Hoyoung Jeong (Daegu, South Korea), Man Hee Park (Suwon-si, South Korea), Hochan An (Hwaseong-si, South Korea) and Tae Hee Kim (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment heat pump system for a vehicle includes a first circuit including a radiator and a fir...