ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,472, issued on March 25, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea).
"Power module" was invented by Nam Sik Kong (Gyeonggi-do, South Korea) and Jun Hee Park (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process."
The patent was filed on Oct. 26, 2022, under Application No. 17/974,266.
*For further ...