US Patent Issued to HYUNDAI MOTOR, KIA on June 24 for "Method for manufacturing semiconductor device and semiconductor device manufactured thereby" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,570, issued on June 24, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).

"Method for manufacturing semiconductor device and semiconductor device manufactured thereby" was invented by Junghee Park (Suwon-si, South Korea), Dae Hwan Chun (Suwon-si, South Korea), Jungyeop Hong (Seoul, South Korea), Youngkyun Jung (Seoul, South Korea) and Nackyong Joo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes forming an N-type layer on the first surface of the N+ type substrate, etching the N-type layer to form a trench, forming a sacrifici...