ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,963, issued on Dec. 30, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).
"Heat pump system for a vehicle" was invented by Seong-Bin Jeong (Seongnam-si, South Korea), Jae-Eun Jeong (Hwaseong-si, South Korea), Yong Woong Cha (Yongin-si, South Korea) and Wan Je Cho (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump system for a vehicle may efficiently adjust the temperature of heating elements by using a chiller where a refrigerant and a coolant exchange heat. At the same time, the heat pump system may efficiently perform cooling and heating of a rear seat by using a rear h...