ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,873, issued on April 29, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).
"Power module" was invented by Myung Ill You (Gwangju, South Korea) and Nam Sik Kong (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module comprises a chip, a power lead electrically connected to the chip and at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer, respectively, wherein the outer metal layer and the inner metal layer ha...