ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,457, issued on Oct. 21, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea).
"Power module" was invented by Se Min Park (Hwaseong-si, South Korea) and Seung Jun Noh (Incheon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a power module that is capable of decreasing the number of components and assembling man-hours by applying a metal clip and performing an integrated soldering process and is capable of keeping a thickness of a soldering part constant and preventing movement of chips at the time of soldering by using a soldering jig."
The patent was filed on Dec. 23, 2022, under Application No. 1...