ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,041, issued on Oct. 14, was assigned to HYOSUNG HEAVY INDUSTRIES Corp. (Seoul, South Korea).
"High-speed molding device" was invented by Jung Woo Park (Changwon-si, South Korea), Dong Woen Lee (Changwon-si, South Korea), Young Soo Chung (Changwon-si, South Korea) and Hyeon Gweon Cheon (Gimhae-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is a high-speed molding device. According to the present invention, a product 14 may be manufactured by filling resin in a cavity 12 formed by a first mold 10 and a second mold. A gas generated during the filling of the cavity 12 with the resin may be discharged through a vent...