US Patent Issued to Hutchinson Technology on Aug. 5 for "High aspect ratio electroplated structures and anisotropic electroplating processes" (Minnesota, Wisconsin Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,687, issued on Aug. 5, was assigned to Hutchinson Technology Inc. (Hutchinson, Minn.).

"High aspect ratio electroplated structures and anisotropic electroplating processes" was invented by Douglas P. Riemer (Waconia, Minn.), Kurt C. Swanson (Chippewa Falls, Wis.) and Peter F. Ladwig (Hutchinson, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating ...