US Patent Issued to Hubei Yangtze Pilot-Line Services on Sept. 30 for "Method for manufacturing packaging enclosure and method for manufacturing packaging chip" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,364, issued on Sept. 30, was assigned to Hubei Yangtze Pilot-Line Services Co. Ltd. (Hubei, China).

"Method for manufacturing packaging enclosure and method for manufacturing packaging chip" was invented by Yiqun Wang (Wuhan, China), Song Wang (Wuhan, China), Yuan Sun (Wuhan, China) and Tianjian Liu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a packaging enclosure includes the following operations. A substrate which has a first surface and a second surface opposite to each other, is provided. A hole of which the bottom is located in the substrate, is formed in the first surface of the substrate. The first...