US Patent Issued to HUAWEI TECHNOLOIGES on July 1 for "Hard drive backplane assembly and electronic device" (Chinese, Austrian Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,464, issued on July 1, was assigned to HUAWEI TECHNOLOIGES Co. LTD. (Shenzhen, China).

"Hard drive backplane assembly and electronic device" was invented by Rong Li (Shenzhen, China), Liangyun Wang (Dongguan, China), Min Wei (Vienna) and Guanglin Lin (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hard drive backplane has a plurality of ventilation holes, and the expansion cavity muffler is mounted in the ventilation holes of the hard drive backplane. The expansion cavity muffler includes at least one expansion cavity and at least one connecting pipe in communication in a first direction. The connecting pipe at one end of the expans...