US Patent Issued to Huawei Technologies on Sept. 30 for "Wavefront parallel processing for tile, brick, and slice" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,366, issued on Sept. 30, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Wavefront parallel processing for tile, brick, and slice" was invented by Fnu Hendry (San Diego) and Ye-Kui Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of decoding includes encountering an end of tile bit with a first value and byte alignment bits in a video bitstream, which indicate that a current coding tree block (CTB) is a last CTB in a tile; encountering an end of CTB row bit with the first value and the byte alignment bits in the video bitstream, which indicate that waveform parallel processing (WPP) is enabled and that the cu...