US Patent Issued to Huawei Technologies on Nov. 25 for "Package structure and package system" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,724, issued on Nov. 25, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Package structure and package system" was invented by Hao Peng (Shanghai) and Xiaojing Liao (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is couple...