US Patent Issued to Huawei Technologies on Dec. 30 for "Electrical lead-out structure and preparation method thereof, hermetic apparatus, and optical communication device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,841, issued on Dec. 30, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Electrical lead-out structure and preparation method thereof, hermetic apparatus, and optical communication device" was invented by Jun Luo (Wuhan, China), Zengguang Guo (Wuhan, China) and Xiaokang Xiao (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up. The reinforcing layer is provided with ...