ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,360, issued on Dec. 30, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).
"Chip transfer method and electronic device" was invented by Haohui Long (Beijing), Shanshan Wei (Shanghai), Yong She (Shanghai) and Jianping Fang (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; ...