US Patent Issued to Huawei Technologies on Dec. 23 for "Foldable module and foldable electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,820, issued on Dec. 23, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"Foldable module and foldable electronic device" was invented by Weifeng Wu (Dongguan, China) and Ding Zhong (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A foldable module is provided, including a first connection part, a first pin, a first drive ring, and a first spring. A first pin hole is disposed on the first connection part, and the first pin passes through the first drive ring, the first pin hole, and the first spring. A first convex part and a first concave part are disposed between the first drive ring and the first connection part, and...