ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,523, issued on Aug. 12, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).
"Heat dissipation apparatus and electronic device" was invented by Lan Li (Shenzhen, China), Linfang Jin (Dongguan, China) and Jinyan Hu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The suppor...