US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Sept. 16 for "Spoof surface plasmon polariton transmission line structure, circuit board, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,747, issued on Sept. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Spoof surface plasmon polariton transmission line structure, circuit board, and electronic device" was invented by Yuan Liang (Chengdu, China) and Dongyu Geng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a spoof surface plasmon polariton transmission line structure, a circuit board, and an electronic device, to reduce a size of the SSPP transmission line structure. The SSPP transmission line structure includes a first dielectric substrate, a first metal strip, and a second metal strip. The first metal strip and the...