US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Sept. 16 for "Connection assembly, board-level architecture, and computing device" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,985, issued on Sept. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Connection assembly, board-level architecture, and computing device" was invented by Dapeng He (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The technology of this disclosure relates to a connection assembly, a board-level architecture, and a computing device. The connection assembly is configured to connect a semiconductor wafer and a lower layer substrate that are disposed opposite to each other, and includes an insulator structure and a plurality of connection terminals that are disposed at spacings. A first end and a second end of any on...