US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Oct. 14 for "Heat dissipation system and electronic device" (Chinese, Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,187, issued on Oct. 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Heat dissipation system and electronic device" was invented by Jianliang Wang (Dongguan, China), Along Zhou (Yokohama, Japan), Huipeng Wu (Dongguan, China), Jian Shi (Shanghai) and Shoubiao Xu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The first heat dissipation panel is provided with a first liquid channel, and the first liquid channel includes a firs...