ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,716, issued on Nov. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Power module, preparation mold, and device" was invented by Fankun Wu (Shanghai), Yunfei Qiao (Shanghai) and Junhe Wang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module is provided. The power module includes a substrate, and the substrate is used to carry components and pins of the power module. A circuit layer is disposed on the substrate, to complete an electrical connection between the carried components. The components and the pins are disposed on a same surface of the substrate, and the components and the pins are electrically connec...