US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Nov. 25 for "Magnetic power component and power module to which magnetic power component is applied" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,590, issued on Nov. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Magnetic power component and power module to which magnetic power component is applied" was invented by Xijun Zhang (Dongguan, China), Jia Li (Xi'an, China), Jun Yao (Dongguan, China), Chao Gao (Dongguan, China), Qiang Gao (Dongguan, China) and Zhitao Li (Xi'an, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A magnetic power component includes a printed circuit board and a magnetic core assembled to the printed circuit board. The magnetic core includes a magnetic core body and a plurality of heat dissipation teeth. The magnetic core body is bonded to the ...