US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Nov. 18 for "Heat dissipation method, heat dissipation apparatus, and cabinet" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,697, issued on Nov. 18, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Heat dissipation method, heat dissipation apparatus, and cabinet" was invented by Xidong Yao (Shenzhen, China), Xiaoguang Sun (Dongguan, China) and Dongming Lu (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The cabinet includes a body and a heat dissipation apparatus. A plurality of installation slots for servers to enter along a preset installation direction are disposed on the body. The heat dissipation apparatus is configured to perform heat dissipation on devices of the servers, the heat dissipation apparatus is disposed on at least one sid...