US Patent Issued to Huawei Technologies'Co., 'Ltd.' on June 3 for "Encapsulation structure and encapsulation method of power module" (Chinese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,678, issued on June 3, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Encapsulation structure and encapsulation method of power module" was invented by Huibin Chen (Shanghai) and Haiyan Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation structure of a power module is disclosed in this application, which includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tub...