ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,480, issued on June 24, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Packaging structure and power amplifier" was invented by Xiaomin Zhang (Dongguan, China), Mingli Huang (Dongguan, China) and Ran Jiang (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component i...