ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,146, issued on June 17, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Temperature equalization component and electronic device" was invented by Yongfu Sun (Shenzhen, China), Jian Shi (Shanghai), Zhi Yuan (Shanghai), Linfang Jin (Dongguan, China) and Jie Yang (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature equalization component and an electronic device are disclosed. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side of the housing that faces a heating ...