ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,149, issued on June 17, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Heat sink and communication device" was invented by Yu Zhang (Minsk, Belarus), Lei Li (Shanghai), Dong Wang (Shanghai) and Meng Wang (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink includes a substrate, a heat dissipation structure, and a refrigerating medium. The heat dissipation structure includes a connection part and a fin part that are of an integrated structure, the connection part is connected to the substrate, the fin part and the connection part are disposed at an included angle, a fin root of the fin part is connected to th...