US Patent Issued to Huawei Technologies'Co., 'Ltd.' on July 8 for "Chip package assembly, electronic device, and preparation method of chip package assembly" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,967, issued on July 8, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Chip package assembly, electronic device, and preparation method of chip package assembly" was invented by Zhaozheng Hou (Dongguan, China), Xiaojing Liao (Shanghai) and Hao Peng (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connecte...