US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 28 for "Shielding cover, shielding can, printed circuit board assembly, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,293, issued on Jan. 28, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Shielding cover, shielding can, printed circuit board assembly, and electronic device" was invented by Huanhuan Yu (Shenzhen, China) and Dongqing Ding (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shielding cover shields and protects a component in an electronic device. The shielding cover includes a cover body and a flexible printed circuit board disposed on the cover body. A first opening is disposed on an end face of the cover body, and the flexible printed circuit board may be affixed to an outer side of the end face of the cover body th...