US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 20 for "Enclosure structure, electronic device, and enclosure structure preparation method" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,332, issued on Jan. 20, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Enclosure structure, electronic device, and enclosure structure preparation method" was invented by Yongtao Cui (Dongguan, China), Yuchan Yang (Shanghai), Rong Ma (Shenzhen, China) and Heshuai Si (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application provide an enclosure structure, an electronic device, and an enclosure structure preparation method; and relate to the field of electronic device technologies. The enclosure structure includes an enclosure and an antenna grain line. At least a part of the enclosure is made o...