US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 13 for "Semiconductor device, method of manufacturing the same and display device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,162, issued on Jan. 13, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Semiconductor device, method of manufacturing the same and display device" was invented by Kano Masataka (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present application provide a semiconductor device and a method of manufacturing the same for implementing both polysilicon TFTs and oxide TFTs with less process complication. The semiconductor device includes first and second thin film transistor structures formed on a substrate. The first TFT structure includes a first transistor and a capacitor on the first transistor, and ...