ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,250, issued on Feb. 18, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Stiffener ring and surface packaging assembly" was invented by Chuncheng Gong (Shenzhen, China), Li Fan (Dongguan, China), Weijin Pan (Dongguan, China), Junwei Mu (Dongguan, China) and Ge Zhang (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffen...