US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Dec. 9 for "Printed circuit board, backplane architecture system, and communication device" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,484, issued on Dec. 9, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Printed circuit board, backplane architecture system, and communication device" was invented by Wenliang Li (Shenzhen, China), Yongwei Chen (Shenzhen, China), Xusheng Liu (Shenzhen, China), Zhong Yan (Dongguan, China) and Zewen Wang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing fac...