US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Dec. 16 for "Heat dissipation apparatus and in-vehicle module" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,537, issued on Dec. 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Heat dissipation apparatus and in-vehicle module" was invented by Yaofeng Peng (Hangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation apparatus includes a heat sink housing including an upper housing and a lower housing. The upper and lowers housing are connected in a sealed manner. A primary PCB is fastened to the upper housing, and the primary PCB and the primary heat dissipation plate of the upper housing are disposed opposite to each other. A chip is fastened to a sub PCB. The sub PCB is electrically connected to the primary PCB ...