US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 5 for "Electronic element, circuit board with electronic element, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,574, issued on Aug. 5, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Electronic element, circuit board with electronic element, and electronic device" was invented by Chenyang He (Shanghai), Ruiming Mo (Shanghai) and Jie Sun (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output ...